CEDC: Capstone Projects

Use this form to submit a Cook Engineering Design Center (CEDC) project proposal.

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1Proposal Details > 2Upload Files > 3Review & Submit
Company Information
Company *
Website
Industry
Sponsor Profile
Sponsor Name Sponsor Name * First Last
Sponsor Job Title *
Sponsor Address Sponsor Address *
Street Address Address Line 2 City State / Province / Region Postal / Zip Code Country
Sponsor Phone *
Sponsor Email *
Have you or your company sponsored a previous project with the CEDC? *

Have you or your company sponsored a previous project with the CEDC? No Yes
Technical Lead

Enter the name and contact info for the Technical Lead assigned to work with students on this project. If the Sponsor is also the Technical Lead managing this project, please fill out the Sponsor's information again below.
Technical Lead Name Technical Lead Name * First Last
Technical Lead Job Title *
Technical Lead Phone *
Technical Lead Email *
Technical Lead Qualifications *
Project Information
Project Title *
Maximum of 80 characters allowed. Currently Entered: 0 characters.
Problem or Need Statement *
Background Information *
Proposed Solution *
Deliverables *
Core Knowledge Area(s) Needed on the Student Team *

Core Knowledge Area(s) Needed on the Student Team Biological Engineering & Biotechnology Biomedical Engineering: Biological & Biomolecular Biomedical Engineering: Electronics, Imaging, Signals Biomedical Engineering: Mechanics & Materials, Device Design Chemical Engineering: Chemical Processes Chemical Engineering: Thermal-Fluid Systems Computer Science & Engineering Electrical Engineering: Analog & Integrated Electronics Electrical Engineering: Digital & Embedded Electronics Electrical Engineering: Electromagnetics, Optics & Radiating Systems Electrical Engineering: Photonics & Semiconductor Devices Electrical Engineering: Signals & Systems Energy Systems Engineering Environmental Engineering Materials Science & Engineering Mechanical Engineering: Mechanical Design Mechanical Engineering: Solid & Structural Mechanics Mechanical Engineering: Systems & Controls Mechanical Engineering: Thermal-Fluid Systems
Additional Knowledge Needed for the Project *
Key Activities *
Key Resources *
Legal Requirements

Read more about confidentiality and intellectual property issues.
Is US citizenship required to participate in this project? *

Is US citizenship required to participate in this project? No Yes
Confidentiality required for sponsor-provided information? *

Confidentiality required for sponsor-provided information? No Yes
Intellectual property ownership rights retained by sponsor? *

Intellectual property ownership rights retained by sponsor? No Yes
Financial Commitment

Read more about the financial commitment, competitive waiver eligibility, and rules.
Are you able to commit to making the $7,500 contribution required to support course and project expenses? *

Are you able to commit to making the $7,500 contribution required to support course and project expenses? Yes No
Financial Waiver Request *
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CEDC: Capstone Projects

CEDC: Capstone Projects

Company Information

Sponsor Profile

Technical Lead

Project Information

Legal Requirements

Financial Commitment